International Conference on Recent Advances and Innovations in Engineering (ICRAIE) International Conference on Recent Advances in Informatics Engineering aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Recent Advances in Informatics Engineering. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Recent Advances in Informatics Engineering.
First IEEE International Conference ICRAIE-2014 could get overwhelming response from all corners of the world. Total 1351 paper submissions in Three tracks viz: Track-1: CSE/IT, Track-2: ECE and Track-3: EE wherein four countries, 9 IITs, 22 NITs, 8 Industries and 30 states of India have participated.
1st International Conference and Workshops on Recent Advances and Innovations in Engineering (IEEE Record # 33681)
Organized by Poornima University and Poornima College of Engineering with Technical Sponsorship of IEEE Delhi Section
Total 223 papers out of 1620 submissions were presented
Organized by IEEE IE/IA Joint Chapter Malaysia with 10 % financial support, Poornima College of Engineering and UiTM Kedah with Technical Sponsorship of IEEE Malaysia Section, Poornima College of Engineering and UiTM Kedah with Technical Sponsorship of IEEE Malaysia Section, IEEE CIS Chapter Poland and IEEE Poland Section at UiTM Kedah
Total 45 papers out of which 197 papers were accepted & presented
Organized by UiTM Kedah and Poornima College of Engineering with technical and 25% financial sponsorship by IEEE IE IA Joint Chapter Malaysia, Technical sponsorship by IEEE Poland Section, IEEE CIS Chapter Poland, IEEE CS Chapter Poland
8th IEEE ICRAIE (IEEE Record #59459) is being jointly organized by Poornima College of Engineering, Jaipur and UiTM Shah Alam, Malaysia, UiTM Kedah Malaysia with Technical and 25% Financial Sponsorship by IEEE IE IA Joint Chapter Malaysia.